首先感謝您選擇和使用深圳市宏芯光科技有限公司的系列LED產(chǎn)品。為增進您對我司產(chǎn)品特性的了解，也為方便您快速掌握產(chǎn)品的基本操作，為盡量減少或避免因人為等因素造成不必要的產(chǎn)品損壞，使其能夠更好的為您的生產(chǎn)服務(wù)，特針對使用過程中的一些規(guī)范使用作相應(yīng)說明，同時即使是同一規(guī)格LED，在實際應(yīng)用領(lǐng)域其可靠性與整體系統(tǒng)設(shè)計水平、作業(yè)方式、使用條件均相關(guān)。本使用說明不可能涵蓋客戶使用過程中可能碰到的所有問題，由此帶來的不便，敬請諒解！
Thanks for using our LED product. In order to enhance your understanding of our product performance, rapidly knowing well of basic operation, avoiding unnecessary product damage owing to incorrect operation, We Shenzhen HXGBRIGHT Technology Co.,Ltd, give you the following guidance of correct usage. Meanwhile, Please keep in mind that the application stable performance even for one LED is largely related to using condition, operating method, and wholly system designing level. The usage instruction is hardly possible to mention all issues occured during the usage, Hope you can understand this.
- 產(chǎn)品申明:使用本產(chǎn)品之前，請貴司務(wù)必預(yù)先進行測試，以便確認是否適合使用目的。產(chǎn)品介紹的用途并不保證不抵觸任何專利，有關(guān)LED產(chǎn)品的進出口法律責任應(yīng)由客戶擔負，請預(yù)先查清每一國家或地區(qū)的有關(guān)規(guī)定。產(chǎn)品可能會因性能提高或規(guī)格參數(shù)改變等緣故，恕不經(jīng)預(yù)告更改。我們要求量產(chǎn)前簽訂正式的產(chǎn)品規(guī)格書。
1. Declaring:In order to confirm if these LEDs are suitable for your application, pretest is necessary before using it. This product presentation does not guarantee not contravene any patent. Relate to imports and exports LED product legal liability should be responsible by customer, so please verify relevant provision about the LED product in your target market. We may change specifications from time to time in the interest of product development, without prior notification or public announcement. An agreement of formal product specifications is required prior to mass production.
2、物料確認：投料的LED、BIN等級是否吻合，如VF、CIE BIN、亮度等是否屬同一等級，同一等級的應(yīng)在一起使用。若不是同一等級的LED應(yīng)用在同一物件上，應(yīng)先評估其適用性，（若不同VF投在一起可能會發(fā)生亮度上的差異，不同CIE BIN<或不同波長的LED>投在一起可能會發(fā)生色差）。
2. Before use:We suggest that the same parameters products should be used together, such as BIN coordinate, VF and luminous flux etc. Feasibility should be checked before applying to product (different VF or CIE BIN would lead to brightness and color discrepancy) to see if workable.
3、包裝儲存：
3.1、真空包裝的儲存：建議SMD系列LED存放在內(nèi)置干燥劑的干燥柜中，儲存環(huán)境為溫度5~ 30℃，濕度≤50%，儲存時間不超三個月。
3.2、拆開包裝后的儲存和使用：
a.拆包裝前應(yīng)檢查包裝確保無漏氣，以及干燥劑無變色（正常顏色為藍色，變成紅色、粉紅色代表受潮）。
b.SMD 防濕包裝拆開后暴露的環(huán)境車間壽命: 在≤30℃/60%RH條件內(nèi)，在線使用時間不超過72小時(Level 4)。
c.開包后的余料在≤30℃/60%RH車間環(huán)境內(nèi)，應(yīng)在2H內(nèi)完成密封，并按照3.1條件儲存。
3.3、如儲存和使用不符合或超過3.1、3.2任意一條規(guī)定，應(yīng)重新除潮（70℃/24小時以上）。
3.4、LED是表面貼裝件，如LED受潮后水氣會進入LED內(nèi)部膠體中，在回流焊高溫條件下，極有可能會發(fā)生LED支架和封裝膠剝離拉斷線材，其發(fā)光通道受到影響而導(dǎo)致亮度下降或發(fā)光顏色變異及死燈等異常。
3.5、LED電極和支架是由鍍銀的銅合金組成，外表銀層易受到腐蝕性的氣體影響，請避免接觸腐蝕的環(huán)境造成LED變色、以免產(chǎn)生LED的焊接性變差或者影響光電性能。請避免環(huán)境溫濕度的驟變，尤其是高濕環(huán)境下易產(chǎn)生水汽凝結(jié)。
3.Packaging & Storage:
3.1. Vacuum packing storage: we suggest that SMD LED series product should be put in dry cabinet. The storage temperature should be 5-30℃,humidity≤50%, and the storage period should not be exceed 3 monthes.
3.2. Storage & using after opening packaging:
a. Please check whether air slipped into packaging and drier had changed color before opening packaging(Normal color is blue while red or pink means damp.
b. After opening the packaging under the environment of ≤30℃/60%RH , LEDs should be used out in 72hours(Level 4)
c. Regarding the balance LEDs under the condition of 30℃/60%RH workshop, we should repack it within 2hours.The storage condition as per item 3.1.
3.3 You have to dehumidify all LEDs at 70℃ for more than 24 hours if do not meet requirement of item 3.1 & item 3.2.
3.4 LED is surface mounting material, it will cause cracking of the lead frame or encapsulation glue during high temperature reflow soldering if damped. Then affect the light efficiency and lead to lumen decrease, color change.
3.5 The pad of chip and lead frame are composed of copper alloy with Ag-plated. And the surface silver layer can be damaged easily by corrosive gas. So You have to keep all LEDs away from corrosive substance and environment to avoid color fade or bad welding which may result in failure of LED. Especially you have to keep all LEDs away from high temperature and high humidity environment
4. 熱沉:
4.1. LED應(yīng)用終端產(chǎn)品應(yīng)重點考慮散熱設(shè)計，LED功率溫升系數(shù)由LED在線路板中的排布密度、熱阻、和環(huán)境溫度來決定。設(shè)計時LED產(chǎn)生的熱量不超過其最大極限值（參考LED Tj結(jié)溫），和其他電子元器件一樣，有必要考慮避開發(fā)熱元件的設(shè)計，LED正負極引腳Ts溫度絕對不可超過85°！
4.2. LED發(fā)光工作時，請考慮其工作電流應(yīng)該由其最大工作結(jié)溫決定，并需參考溫度與電流曲線進行TS溫度設(shè)計和重點管控！
4. Heat Sink:
4.1. Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification.
4.2. The operating current should be decided after considering the ambient maximum temperature of LEDs.
5. 焊接條件:
5.1、產(chǎn)品是否適合回流焊制程請參考對應(yīng)產(chǎn)品的規(guī)格書。宏芯光不對浸潤式的焊接方式進行質(zhì)保。
5.2、回流焊焊接溫度及時間請參照對應(yīng)產(chǎn)品規(guī)格書。LED不可進行兩次或以上的回流焊接。回流焊后使用過程中避免鑷子等鋒利工具觸碰硅膠膠體部分（尤其是在LED回流焊后完全冷卻前，不應(yīng)該有任何外力作用于膠體和材料堆疊在一起）。
5.3、不建議將LED貼裝在彎曲的線路板上。焊接時避免快速冷卻，在LED焊接冷卻過程中避免任何形式的機械力或過度的震動，焊接后，不要彎曲線路板。
5.4、完成焊接的LED不宜進行返修作業(yè)。如不可避免，采用加熱臺或雙頭烙鐵，但事先應(yīng)確認返修是否會對LED的特性產(chǎn)生破壞。
5. Recommended soldering
5.1. Please refer to LED specification corresponded whether the product is adaptable to reflow process. HXGBRIGHT cannot make guarantee on the LEDs after they have been assembled using the dip soldering method.
5.2. Reflow soldering temperature and time, please refer to the corresponding product specifications.LED is unfavorable for the first of two or more than two times of reflow soldering. Avoid tweezers or other sharp tools touch the silicone gel part during reflow soldering process (Cool the LEDs completely, especially after reflow soldering, there should be no external force acting on colloid and materials stacked together before cool)
5.3. Components should not be mounted on warped direction of PCB. Please avoid rapid cooling after soldering. Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp after soldering. After soldering，do not warp the PCB.
5.4. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron is suggested. It should be confirmed before handing whether the characteristics of the LEDs will not be damaged by repairing.
6. 靜電防護:
LED是靜電敏感電子元器件，應(yīng)采取各種措施避免靜電，諸如在使用過程中戴有線靜電手環(huán)和防靜電手套。所有的裝置、設(shè)備儀器應(yīng)良好的接地。建議對組裝后的LED產(chǎn)品進行測試檢查LED是否受到靜電的破壞，白光或藍光LED確認方法為（參考）：1mA或2.5V/單顆芯片不能點亮或同等條件下亮度較其他LED明顯偏暗為缺陷品。
6. Protection of static electricity:
These products are sensitive to static electricity charge. Please take measures to prevent any static electricity being produced such as the wearing of a wristband or anti-static gloves when handling this product. All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment .When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test @1mA/ a dice(reference)
7. 清潔清洗:
建議使用異丙醇來清潔LED，如果要采用其他溶劑清潔，一定要確保此溶劑不會對環(huán)氧、有機硅、硅膠、支架鍍銀層等產(chǎn)生影響。不建議使用超聲波清洗以免對LED造成損傷。若不可避免，清洗前請事先進行預(yù)測試，以確認是否對LED造成不良影響或潛在性隱患。
7. HXGBRIGHT suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. If have to do that, please pre-test the new method, it will avoid for bad influence or potential pitfalls.
8、其他注意事項：
8.1、白光LED是由藍光芯片和特種熒光粉組合。因此，LED的發(fā)光顏色會隨著工作電流的變化而發(fā)生變化，使用前應(yīng)考慮此因素是否能達到預(yù)期效果。
8.2、砷化鎵應(yīng)用在某些發(fā)射管上，這類產(chǎn)品在廢棄處理過程中禁止碎化或燃燒以免引起危害。由此類產(chǎn)品在廢棄處理過程產(chǎn)生的氣體或液體，吸入或飲用亦是危險的。
8.3、LED長時間暴露在陽光或偶爾暴露在紫外線下可能導(dǎo)致膠體或透鏡黃變。
8.4、為保證LED光電性能，請保持LED發(fā)光區(qū)域表面清潔，避免手指印或其它異物覆蓋。
8.5、不建議在LED的硅膠表面覆蓋其它與之不兼容的脂類物質(zhì)。
8.6、鑒于吸嘴的形式，除了要避免作用在硅膠表面的機械外力，對SMT貼裝制程基本無限制。
8.7、請留意避免LED在組裝時與其它組件發(fā)生干涉現(xiàn)象。
8.8、在設(shè)計電路時應(yīng)預(yù)防開關(guān)過程中產(chǎn)生逆向電壓或過大電流對LED的瞬間沖擊。
8.9、SMD支架為鍍銀支架，銀容易與硫、鹵族元素發(fā)生反應(yīng)，導(dǎo)致外觀和光色發(fā)生變異，請在生產(chǎn)及使用環(huán)境應(yīng)避免和遠離硫、鹵元素。
8.10、硫?qū)儆?/font>LED鍍銀層敏感物質(zhì)。目前無參考標準，我們的建議標準為：S≤500PPM。且原材料表面不能有含硫溶液殘留。
8.11、鹵素建議標準：Cl≤900PPM，Br≤900PPM，Cl+Br≤1500PPM（參考IEC、IPC 標準）且原材料表面不能有含鹵溶液殘留。
8.12、建議客戶做燈條及軟燈帶等產(chǎn)品時貼板方式采用豎貼，避免橫貼造成燈珠折疊PCB時發(fā)生破損！
8.13、產(chǎn)品符合RoHs指令，產(chǎn)品意圖主要應(yīng)用在通用電氣設(shè)備（如辦公自動設(shè)備、通訊設(shè)備、視聽設(shè)備、家用電器、測量工等）特別是通用照明。一旦應(yīng)用在高可靠度或由于故障失效而直接影響人身安全等領(lǐng)域產(chǎn)品上（航空產(chǎn)品、醫(yī)療設(shè)備、動控制系統(tǒng)等），請事先聯(lián)系我們的銷售代表。
8. Other caution:
8.1. The White LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs.
8.2. Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned
or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed.
8.3. Long time exposure of sunlight or occasional UV exposure will cause colloid and lens discoloration.
8.4. To ensure the LED photoelectric parameters, please keep the light-emitting region surface clean. Avoiding finger print and other foreign be covered.
8.5. Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc)
8.6. When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and placenozzle, except that mechanical pressure on the surface of the resin must be prevent.
8.7. Please be aware that this product should not come into contact with other parts in assembled status.
8.8. Please design a circuit that prevents any reverse voltage (excess current) from being applied to this product instantaneously when the circuit is ON or OFF.
8.9. Surface of Lead frame is Ag-plated and elementary substance Ag easily react with sulphur and halogen material(F, CL,Br and I), which result in change of surface and color. So you have to keep LED away from those elementary substance listed above( may contained in accessories, raw material of driver and environmental materials) to avoid LED failure(Decay, color shift and failure)
8.10. Sulfide belongs LED silvering layer sensitive substances. Currently no reference standard, we recommend standards: S≤500PPM. And the raw material surface haven’t sulfide residual solution.
8.11. Halogen proposed standard: Cl≤900PPM, Br≤900PPM, Cl + Br≤1500PPM (reference IEC, IPC standards) and ahalogen-containing material surface can’t have a solution residues.
8.12. Customers are adviced to adopt vertical stick method when they produce light bar or soft light with other products. Pleasedon’t cross stick method.
8.13. This product complies with RoHs directives. This product is intended for the application in general electronic devices (such as office automation equipment, communication devices, audio-video equipment, home electrical appliances, measurement hardware and others), especially in general lighting. In cases where this product is used for the applications that requires high reliability or could directly affect human life or health due to failure or malfunction (aerospace hardware, medical equipment, atomic control equipment and others), please consult with our sales representatives beforehand. Our warranty does not cover situations where this product undergoes secondary fabrication such as changes in shape.
